this is information on a product in full production. january 2013 doc id 022548 rev 2 1/9 9 DIP1524-01D3 gps/glonass and 2.4 ghz diplexer datasheet ? production data features low insertion loss high attenuation levels input power for gps: 25 dbm max input power for wlan: 28 dbm max high power capacity lead-free, flip-chip package small footprint very low profile (< 630 m thickness) high rf performance applications multi-band power amplifier module multi-band front end module multi-band gsm/wcdma mobile phone pc (netbooks, tablet) and smartphones description the DIP1524-01D3 is a diplexer designed to separate the rf received signals of the gps-glonass from the rf received signals in the 2.4 to 2.7 ghz band. the DIP1524-01D3 has been designed using stmicroelectronics ipd (integrated passive device) technology on non conductive glass substrate to optimize rf performance. figure 1. schematic diagram (top view) flip-chip package 4 bumps p1 gnd p3 p2 rx antenna p1 p2 p3 gps/glonass rx wlan, bte lte band vii 12 a c b www.st.com
characteristics DIP1524-01D3 2/9 doc id 022548 rev 2 1 characteristics table 1. a bsolute maximum rating (limiting values) symbol parameter value unit min. typ. max. p in input power p 1 28 dbm input power p 2 (gps) 25 v esd (hbm) human body model, jesd22-a114-b, all i/o 300 v v esd (mm) machine model, jesd22-a115-a, all i/o 100 v v esd (cdm) charge device model, jesd22-c101-c, all i/o 500 v t op operating temperature range -30 +85 oc table 2. electrical characteristics and rf performance (t amb = 25 c) symbol parameter test condition value unit min typ max f1 pass band range wlan, bt, lte band vii 2400 2700 mhz f2 gps: 1573.42 ? 1577.42 mhz glonass: 1 597.55 ? 1605.89 mhz 1573.42 1605.89 mhz il p1-p3 in f1: wlan, bt, lte band vii 0.85 0.90 db p2-p3 in f2: gps 0.60 0.65 in f2: glonass 0.65 0.75 attenuation p1-p3 in f2 20 p2-p3 in f1 18 return loss p1 in f1 -10 p2 in f2 -20 p3 in f1 and f2 -9.5
DIP1524-01D3 characteristics doc id 022548 rev 2 3/9 1.1 rf measurement measurements performed at component level ? figure 2. p1-p3 and p2-p3 - s13 and s23 forward transmission figure 3. p1-p3 - s13 insertion loss in f1 band f (ghz) s13, s23 (db) s13 s23 01 2 34 5 6 0 -5 -10 -15 -20 -25 -30 -35 f (ghz) s13 (db) 2.40 2.45 2.50 2.55 2.60 2.65 2.70 -0.70 -0.75 -0.80 -0.85 -0.90 m1 m2 m1 f = 2.400 ghz s13 = -0.861 db m2 f = 2.700 ghz s13 = -0.812 db figure 4. p2-p3 - s23 insertion loss in f2 band (gps) figure 5. p2-p3 - s23 insertion loss in f2 band (glonass) f (ghz) s23 (db) 1.570 1.572 1.574 1.576 1.578 1.580 -0.50 -0.55 -0.60 -0.65 -0.70 m3 m3 f = 1.575 ghz s23 = -0.580 db f (ghz) s23 (db) 1.595 1.600 1.605 1.610 -0.50 -0.55 -0.60 -0.65 -0.70 m5 m4 m4 f = 1.595 ghz s23 = -0.603 db m5 f = 1.605 ghz s23 = -0.624 db figure 6. p1-p3 - s13 attenuation in f2 band figure 7. p2-p3 - s23 attenuation in f1 band f (ghz) s13 (db) 1.570 1.575 1.580 1.585 -15 -20 -25 -30 -35 m7 m6 m6 f = 1.575 ghz s13 = -23.141 db m7 f = 1.605 ghz s13 = -27.723 db 1.590 1.595 1.600 1.605 1.610 f (ghz) s23 (db) 2.40 2.45 2.50 2.55 -15 -20 -25 -30 -35 m9 m8 m8 f = 2.400 ghz s23 = -19.084 db m9 f = 2.700 ghz s23 = -24.617 db 2.60 2.65 2.70
characteristics DIP1524-01D3 4/9 doc id 022548 rev 2 figure 8. p1, p2, p3 - sxx reflection coefficient figure 9. p1 - s11 return loss in f1 band f (ghz) s11, s22, s33 (db) s11 s22 s33 01 2 34 5 6 0 -5 -10 -15 -20 -25 -30 -35 f (ghz) s11 (db) 2.40 2.45 2.50 2.55 -5 -10 -25 -15 -30 -20 -35 m11 m10 m10 f = 2.400 ghz s11 = -13.229 db m11 f = 2.700 ghz s11 = -11.059 db 2.60 2.65 2.70 figure 10. p2 - s22 return loss in f2 band figure 11. p3 - s33 return loss in f1 band f (ghz) s22 (db) 1.570 1.575 1.580 1.585 -15 -5 -20 -10 -25 -30 -35 m13 m12 m12 f = 1.575 ghz s22 = -31.730 db m13 f = 1.605 ghz s22 = -27.778 db 1.590 1.595 1.600 1.605 1.610 f (ghz) s33 (db) 2.40 2.45 2.50 2.55 -5 -10 -25 -15 -30 -20 -35 m15 m14 m14 f = 2.400 ghz s33 = -11.442 db m15 f = 2.700 ghz s33 = -10.102 db 2.60 2.65 2.70 figure 12. p3 - s33 return loss in f2 band figure 13. p1-p2 - s12 isolation 1.570 1.575 1.580 1.585 1.590 1.595 1.600 1.605 1.610 f (ghz) s33 (db) -5 -10 -25 -15 -30 -20 -35 m17 m16 m16 f = 1.575 ghz s33 = -24.600 db m17 f = 1.605 ghz s33 = -22.469 db f (ghz) s12 (db) 01 2 34 5 6 0 -5 -10 -15 -20 -25 -30 -35
DIP1524-01D3 ordering information scheme doc id 022548 rev 2 5/9 2 ordering information scheme figure 16. ordering information scheme figure 14. p1-p2 - s12 isolation in f1 band figure 15. p1-p2 - s12 isolation in f2 band f (ghz) s12 (db) 2.40 2.45 2.50 2.55 -15 -20 -25 -30 -35 m21 m20 m20 f = 2.400 ghz s23 = -19.224 db m21 f = 2.700 ghz s23 = -24.375 db 2.60 2.65 2.70 f (ghz) s12 (db) 1.570 1.575 1.580 1.585 -15 -20 -25 -30 -35 m19 m18 m18 f = 1.575 ghz s12 = -22.399 db m19 f = 1.605 ghz s12 = -24.812 db 1.590 1.595 1.600 1.605 1.610 dip 15 24 01 d3 ipd family f1 band design version package diplexer 1st version d3 = glass substrate f2 band
package information DIP1524-01D3 6/9 doc id 022548 rev 2 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 17. package dimensions figure 18. footprint figure 19. marking 840 m 1360 m 400 m 400 m 6 0 m 3 p1 gnd p3 p2 top view ? 255 m copper pad diameter: 220 m recommended solder stencil opening: 220 m recommended solder mask opening: 300 m minimum 260 m maximum x y x w z w dot, st logo ecopack grade xx = marking z = manufacturing location yww = datecode (y = year ww = week)
DIP1524-01D3 package information doc id 022548 rev 2 7/9 figure 20. tape and reel specifications note: more information is availa ble in the application note: an2348, ?ipad? 400 m flip chip: package description and recommendations for use? dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.50 0.75 0.94 0.20 1.46 st xxz yww st xxz yww st xxz yww
ordering information DIP1524-01D3 8/9 doc id 022548 rev 2 4 ordering information 5 revision history table 3. ordering information order code marking package weight base qty delivery mode DIP1524-01D3 rt flip chip 1.35 mg 5000 tape and reel (7?) table 4. document revision history date revision changes 14-feb-2012 1 initial release 17-jan-2013 2 updated package graphics for clarity.
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